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MTA9ASF1G72PZ-2G6

Orderable parts

MTA9ASF1G72PZ-2G6B1
MTA9ASF1G72PZ-2G6D1
MTA9ASF1G72PZ-2G6J1

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    2666 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72
  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    2666 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72
  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    2666 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72

Data Sheets

8GB (x72, ECC, SR) 288-Pin DDR4 RDIMM

MTA9ASF1G72PZ – 8GB
  • File Type: PDF
  • Updated: 2021-05-27

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2024

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2024

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2024

Simulation Models

Spice

D2
  • File Type: ZIP
  • Updated: 2017-07-20

IBIS

D2
  • File Type: ZIP
  • Updated: 2017-07-20

Technical Notes

TN-00-01: Moisture Sensitivity of Plastic Packages

This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.
  • File Type: PDF
  • Updated: 2023-08-25

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-04-42: Memory Module Serial Presence-Detect

This technical note describes how serial presence-detect (SPD) is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules.
  • File Type: PDF
  • Updated: 2009-12-16

Customer Service Notes

CSN-43: Micron's Server and Workstation DRAM DID-Agnostic Parts

This customer service note provides information explaining Micron’s design identification (DID) agnostic parts and the associated part numbering system offered by our Commercial Products Group (CPG).
  • File Type: PDF
  • Updated: 2022-07-21

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06
See All
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