MTA72ASS8G72PSZ-2S6

Orderable parts

MTA72ASS8G72PSZ-2S6E1
MTA72ASS8G72PSZ-2S6G1

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    4Gb x 4
  • Data Rate
    2666 MT/s
  • Density
    64GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72
  • Chipset Validation
    N/A
  • Comp. Config
    4Gb x 4
  • Data Rate
    2666 MT/s
  • Density
    64GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72

Data Sheets

64GB (x72, ECC, 3DS 2H Stack, 2 Package Ranks x 2 Logic Ranks) 288-Pin DDR4 RDIMM

  • File Type: PDF
  • Updated: 2021-05-27

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 1/1/2022

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 1/1/2022

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 1/1/2022

Simulation Models

Spice

G1
  • File Type: ZIP
  • Updated: 2019-03-07

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-00-22: Micron Wire-Bonding Techniques

This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
  • File Type: PDF
  • Updated: 2010-11-23

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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