MTA36ASF4G72PZ-3G2

Orderable parts

MTA36ASF4G72PZ-3G2E2

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    2Gb x 4
  • Data Rate
    3200 MT/s
  • Density
    32GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72

Data Sheets

32GB (x72, ECC, DR) 288-Pin DDR4 RDIMM

MTA36ASF4G72PZ – 32GB
  • File Type: PDF
  • Updated: 2019-06-24

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 9/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 9/1/2019

Simulation Models

Spice

E2
  • File Type: ZIP
  • Updated: 2018-10-17

Spice

E1
  • File Type: ZIP
  • Updated: 2018-01-17

HyperLynx

J1
  • File Type: ZIP
  • Updated: 2019-05-28

IBIS

E2
  • File Type: ZIP
  • Updated: 2018-02-07

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-01: Moisture Sensitivity of Plastic Packages

This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.
  • File Type: PDF
  • Updated: 2018-10-15

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
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