MTA36ASF4G72PZ-2G6

Orderable parts

MTA36ASF4G72PZ-2G6D1
MTA36ASF4G72PZ-2G6E1

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    2Gb x 4
  • Data Rate
    2666 MT/s
  • Density
    32GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72
  • Chipset Validation
    N/A
  • Comp. Config
    2Gb x 4
  • Data Rate
    2666 MT/s
  • Density
    32GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72

Data Sheets

32GB (x72, ECC, DR) 288-Pin DDR4 RDIMM

MTA36ASF4G72PZ – 32GB
  • File Type: PDF
  • Updated: 2019-06-24

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 9/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 9/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 9/1/2020

Simulation Models

Spice

H1
  • File Type: ZIP
  • Updated: 2017-09-25

Spice

D2
  • File Type: ZIP
  • Updated: 2017-07-20

Spice

D1
  • File Type: ZIP
  • Updated: 2016-06-08

HyperLynx

J1
  • File Type: ZIP
  • Updated: 2019-05-28

Hyperlynx

E4
  • File Type: ZIP
  • Updated: 2018-05-11

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-04-54: High-Speed DRAM Controller Design

This technical note identifies and discusses five key areas of DRAM controller design.
  • File Type: PDF
  • Updated: 2008-04-16

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-09-08

CSN-37: Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09
See All
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