MTA36ASF4G72PZ-2G3

Orderable parts

MTA36ASF4G72PZ-2G3A1
MTA36ASF4G72PZ-2G3B1
MTA36ASF4G72PZ-2G3D1

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    2Gb x 4
  • Data Rate
    2400 MT/s
  • Density
    32GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72
  • Chipset Validation
    N/A
  • Comp. Config
    2Gb x 4
  • Data Rate
    2400 MT/s
  • Density
    32GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72
  • Chipset Validation
  • Comp. Config
    2Gb x 4
  • Data Rate
    2400 MT/s
  • Density
    32GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72

Data Sheets

32GB (x72, ECC, DR) 288-Pin DDR4 RDIMM

MTA36ASF4G72PZ – 32GB
  • File Type: PDF
  • Updated: 2019-06-24

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2020

Simulation Models

Spice

B1
  • File Type: ZIP
  • Updated: 2016-11-01

Spice

D1
  • File Type: ZIP
  • Updated: 2016-06-08

Spice

A1
  • File Type: ZIP
  • Updated: 2015-04-27

HyperLynx

J1
  • File Type: ZIP
  • Updated: 2019-05-28

IBIS

B1
  • File Type: ZIP
  • Updated: 2016-09-19

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-04-42: Memory Module Serial Presence-Detect

This technical note describes how serial presence-detect (SPD) is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules.
  • File Type: PDF
  • Updated: 2009-12-16

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
See All
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