MTA18ASF4G72PDZ-3G2F1

MTA18ASF4G72PDZ – 32GB

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

Company statement regarding REACH SVHC compliance

MTA18ASF4G72PDZ-3G2F1

This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

This technical note describes how serial presence-detect (SPD) is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules.

Explanation of Micron packaging labels and procedures.

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.