MTA18ASF2G72PDZ-3G2

Orderable parts

MTA18ASF2G72PDZ-3G2E1
MTA18ASF2G72PDZ-3G2J1
MTA18ASF2G72PDZ-3G2J3
MTA18ASF2G72PDZ-3G2R1

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    3200 MT/s
  • Density
    16GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72
  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    3200 MT/s
  • Density
    16GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72
  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    3200 MT/s
  • Density
    16GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72
  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    3200 MT/s
  • Density
    16GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72

Data Sheets

16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM

MTA18ASF2G72PDZ – 16GB
  • File Type: PDF
  • Updated: 2021-03-17

288-Pin DDR4 RDIMM Core Data Sheet

  • File Type: PDF
  • Updated: 2019-10-14

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2021

Simulation Models

HyperLynx

E1
  • File Type: ZIP
  • Updated: 2019-06-06

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-00-22: Micron Wire-Bonding Techniques

This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
  • File Type: PDF
  • Updated: 2010-11-23

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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