MT72KSZS4G72PZ-1G4

Orderable parts

MT72KSZS4G72PZ-1G4E2

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    2Gb x 4
  • Data Rate
    1333 MT/s
  • Density
    32GB
  • FBGA Code
    N/A
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72

Data Sheets

16GB, 32GB (x72, ECC, QR) 240-Pin DDR3L RDIMM

  • File Type: PDF
  • Updated: 2013-07-31

Simulation Models

IBIS

E2
  • File Type: ZIP
  • Updated: 2013-02-21

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-00-22: Micron Wire-Bonding Techniques

This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
  • File Type: PDF
  • Updated: 2010-11-23

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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