MT18JSF1G72PDZ-1G9

Orderable parts

MT18JSF1G72PDZ-1G9E2
MT18JSF1G72PDZ-1G9N1
MT18JSF1G72PDZ-1G9P1

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    512 Meg x 8
  • Data Rate
    1866 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72
  • Chipset Validation
    N/A
  • Comp. Config
    512 Meg x 8
  • Data Rate
    1866 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72
  • Chipset Validation
    N/A
  • Comp. Config
    512 Meg x 8
  • Data Rate
    1866 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72

Data Sheets

8GB (x72, ECC, DR) 240-Pin DDR3 RDIMM

Rev. G
  • File Type: PDF
  • Updated: 2015-10-26

Simulation Models

SPICE

E1
  • File Type: ZIP
  • Updated: 2012-09-20

IBIS

E1
  • File Type: ZIP
  • Updated: 2013-05-13

Technical Notes

TN-00-01: Moisture Sensitivity of Plastic Packages

This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.
  • File Type: PDF
  • Updated: 2020-07-09

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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