N25Q032A13ESE40E

Orderable parts

N25Q032A13ESE40E

Specs

  • Chipset Validation
    N/A
  • Density
    32Mb
  • FBGA Code
    N/A
  • Media
    Tray
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Multi I/O
  • Width
    x1/x2/x4

Data Sheets

32Mb, 3V, Multiple I/O Serial Flash Memory

32Mb, 3V, Multiple I/O, 4KB Subsector Erase, XiP Enabled, Serial NOR Flash Memory with 108 MHz Serial Peripheral Interface
  • File Type: PDF
  • Updated: 2018-05-31

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-25-09: Layout Guidelines - Serial NOR Flash

This technical note provides PCB designers basic guidelines for optimizing signal layout and power supply lines in Micron's Serial NOR Flash device to prevent signal integrity problems.
  • File Type: PDF
  • Updated: 2016-07-11
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
See All
+