N25Q032A13ESE40E

Orderable parts

N25Q032A13ESE40E

Specs

  • Chipset Validation
    N/A
  • Density
    32Mb
  • FBGA Code
    N/A
  • Media
    Tray
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Multi I/O
  • Width
    x1/x2/x4

Data Sheets

32Mb, 3V, Multiple I/O Serial Flash Memory

32Mb, 3V, Multiple I/O, 4KB Subsector Erase, XiP Enabled, Serial NOR Flash Memory with 108 MHz Serial Peripheral Interface
  • File Type: PDF
  • Updated: 2018-05-31

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2020

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 2017-11-15
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
See All
+