MT25QU01GBBB8ESF-0SIT

Orderable parts

MT25QU01GBBB8ESF-0SIT

Specs

  • Chipset Validation
    N/A
  • Density
    1Gb
  • FBGA Code
    RW192
  • Media
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Stacked
  • Width
    x1/x2/x4

Data Sheets

MT25Q, 2Gb, 1.8V Multiple I/O Serial Flash Memory Data Sheet

MT25Q is a high-performance multiple input/output, 2Gb, 1.8V, SPI Flash memory device; MT25QU02GCBB
  • File Type: PDF
  • Updated: 2019-05-15

MT25Q, 1Gb, 1.8V Multiple I/O Serial Flash Memory Data Sheet

MT25Q is a high-performance multiple input/output, 1Gb, 1.8V, SPI Flash memory device; MT25QU01GBBB
  • File Type: PDF
  • Updated: 2018-06-05

MT25Q Devices: Multiple I/O Serial Flash Memory Electrical Addendum

DC Characteristics; VIH and VIL
  • File Type: PDF
  • Updated: 2018-09-19

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2020

Simulation Models

IBIS_MT25QU01GBBBxxPP-xxTT v2.2

PP= 12, SF, W9. TT= IT, AT, AUT.
  • File Type: ZIP
  • Updated: 2017-09-25

MT25Q_1Gb_1.8V_64KB_MicronXIP_Reset_RevB_Standard_VG1.2.tar

Verilog model, Standard model, MT25QU01GBBB8Epp-0
  • File Type: GZ
  • Updated: 2019-03-27

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 2017-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
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