MT25QL128ABA8ESF-0SIT

Orderable parts

MT25QL128ABA8ESF-0SIT

Specs

  • Chipset Validation
    N/A
  • Density
    128Mb
  • FBGA Code
    RW207
  • Media
    Tray, Tape & Reel
  • Op. Temp.
    -40C to +85C
  • Product Longevity Program
    Yes
  • Product Longevity Program Start Date
    5/4/2011
  • Type
    Multi I/O
  • Width
    x1/x2/x4

Data Sheets

MT25Q 128Mb, 3V, Multiple I/O Serial Flash Memory MT25QL128ABA

MT25QL128ABA is a high-performance multiple input/output, 128Mb, 3V, SPI Flash memory device.
  • File Type: PDF
  • Updated: 2019-04-26

MT25Q Devices: Multiple I/O Serial Flash Memory Electrical Addendum

DC Characteristics; VIH and VIL
  • File Type: PDF
  • Updated: 2018-09-19

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2023

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2023

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2023

Simulation Models

IBIS_MT25QL128ABAxxPP-xxTT v2.7

PP= 12, 14, SE, SF, W7, W9. TT= IT, AT.
  • File Type: ZIP
  • Updated: 2019-03-06

MT25Q_128Mb_3V_64KB_MicronXIP_Reset_VG13

Verilog model MT25QL128ABA8E0
  • File Type: GZ
  • Updated: 2019-03-22

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 2017-11-15

TN-25-09: Layout Guidelines - Serial NOR Flash

This technical note provides PCB designers basic guidelines for optimizing signal layout and power supply lines in Micron's Serial NOR Flash device to prevent signal integrity problems.
  • File Type: PDF
  • Updated: 2016-07-11
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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