Orderable parts



  • Block Config
    Bottom Boot
  • Chipset Validation
  • Density
  • FBGA Code
  • Op. Temp.
    -40C to +85C
  • Part Family
  • Part Status
  • Product Longevity Program
  • Product Longevity Program Start Date
  • Width

Data Sheets

512Mb, 1Gb, 2Gb P30 Parallel NOR Flash data sheet

65nm; MLC; 28F512P30B/E/TF, 28F00AP30B/E/TF, 28F00BP30EF
  • File Type: PDF
  • Updated: 2017-05-25

Simulation Models

P30_IBIS, 1Gb, 65nm, EzBGA64, 1.7-2.0V, v1.01

  • File Type: IBS
  • Updated: 2011-04-29

P30_Verilog, 1Gb, 65nm, v1.7

P30_Verilog, 1Gb, 65nm, v1.7
  • File Type: GZ
  • Updated: 2012-10-09

Technical Notes

TN-12-06: Adapting the Linux Kernel for Micron P30, P33, and J3 Flash Memory

This technical note provides a guide for modifying the MTD device-layer software for correct use with Micron P30, P33, and J3 devices. It also describes the modifications required in the Linux environment.
  • File Type: PDF
  • Updated: 2011-10-17

TN-12-05: Password Protecting Flash Memory Blocks

This document describes a method of password protecting blocks using Micron's M29EW device, as an example.
  • File Type: PDF
  • Updated: 2011-03-11
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
See All