MT29F4G01ABAFDWB-IT

Orderable parts

MT29F4G01ABAFDWB-IT:F

Specs

  • Chipset Validation
    N/A
  • Density
    4Gb
  • FBGA Code
    NQ464
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x1

Data Sheets

Production Data Sheet: 4Gb 3.3V x1, x2, x4: SPI NAND Flash Memory

M70A; SLC; MT29F4G01ABAFDWB, MT29F4G01ABAFD12
  • File Type: PDF
  • Updated: 2019-08-15

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2021

Technical Notes

TN-29-17: NAND Flash Design and Use Considerations

This technical note presents effective design and use practices to help avoid potential problems.
  • File Type: PDF
  • Updated: 2018-11-21

TN-29-58: ONFI NV-DDR2 Design Guide

This technical note explains the device features that enable NV-DDR2 and provides guidelines for system designs to enable I/O transfer rates of up to 400 MT/s using the NV-DDR2 interface.
  • File Type: PDF
  • Updated: 2016-09-29
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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