MT29F256G08CEECBH6-12

Orderable parts

MT29F256G08CEECBH6-12:C

Specs

  • Chipset Validation
    N/A
  • Density
    256Gb
  • FBGA Code
    NW657
  • Op. Temp.
    0C to +70C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

Datasheet: NAND 128/256/512Gb/1Tb/2Tb, MLC, Async/Sync, L95B

Datasheet: NAND 128/256/512Gb/1Tb/2Tb, MLC, Async/Sync, L95B
  • File Type: PDF
  • Updated: 2018-01-24

Simulation Models

HSpice: 128Gb 256Gb 512Gb 1Tb Async Sync NAND

Rev 2.3
  • File Type: ZIP
  • Updated: 2016-03-03

IBIS: 128Gb 256Gb 512Gb 1Tb 2Tb Async Sync NAND

Rev 2.3
  • File Type: ZIP
  • Updated: 2016-03-03

Verilog: MLC 128Gb to 2Tb Async/Sync NAND L95B

128GB/2TB Verilogg model 7.30
  • File Type: ZIP
  • Updated: 2017-03-06

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-29-65: Software Device Drivers for Very Large Page Micron NAND Flash Memory

Download the low-level driver described in this document here.
  • File Type: PDF
  • Updated: 2010-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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