MT29F256G08CEECBH6-12

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Orderable parts

MT29F256G08CEECBH6-12:C

Specs

Chipset Validation

N/A
Density

256Gb
FBGA Code

NW657
Op. Temp.

0C to +70C
Product Longevity Program

No
Product Longevity Program Start Date

N/A
Width

x8

Data Sheets

Datasheet: NAND 128/256/512Gb/1Tb/2Tb, MLC, Async/Sync, L95B

File Type: PDF
Updated: 2018-01-24

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Simulation Models

HSpice: 128Gb 256Gb 512Gb 1Tb Async Sync NAND

Rev 2.3

File Type: ZIP
Updated: 2016-03-03

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IBIS: 128Gb 256Gb 512Gb 1Tb 2Tb Async Sync NAND

Rev 2.3

File Type: ZIP
Updated: 2016-03-03

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Verilog: MLC 128Gb to 2Tb Async/Sync NAND L95B

128GB/2TB Verilogg model 7.30

File Type: ZIP
Updated: 2017-03-06

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Technical Notes

TN-00-38: Anticipating ESD Technology Roadmap Trends

Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hardening precautions for the handling and assembly of semiconductor die, wafers, packages, and PCBs.

File Type: PDF
Updated: 2023-06-30

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TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

File Type: PDF
Updated: 2022-08-09

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TN-29-65: Software Device Drivers for Very Large Page Micron NAND Flash Memory

Download the low-level driver described in this document here.

File Type: PDF
Updated: 2010-10-15

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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.

File Type: PDF
Updated: 2021-12-06

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CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.

File Type: PDF
Updated: 2009-04-06

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