MT29F256G08CEECBH6-12

Orderable parts

MT29F256G08CEECBH6-12:C

Specs

  • Chipset Validation
    N/A
  • Density
    256Gb
  • FBGA Code
    NW657
  • Op. Temp.
    0C to +70C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

Datasheet: NAND 128/256/512Gb/1Tb/2Tb, MLC, Async/Sync, L95B

Datasheet: NAND 128/256/512Gb/1Tb/2Tb, MLC, Async/Sync, L95B
  • File Type: PDF
  • Updated: 2018-01-24

Simulation Models

HSpice: 128Gb 256Gb 512Gb 1Tb Async Sync NAND

Rev 2.3
  • File Type: ZIP
  • Updated: 2016-03-03

IBIS: 128Gb 256Gb 512Gb 1Tb 2Tb Async Sync NAND

Rev 2.3
  • File Type: ZIP
  • Updated: 2016-03-03

Verilog: MLC 128Gb to 2Tb Async/Sync NAND L95B

128GB/2TB Verilogg model 7.30
  • File Type: ZIP
  • Updated: 2017-03-06

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-29-65: Software Device Drivers for Very Large Page Micron NAND Flash Memory

Download the low-level driver described in this document here.
  • File Type: PDF
  • Updated: 2010-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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