MRDIMM memory

MRDIMM is where dual-rank DDR5 modules are combined with a multiplexer buffer and a memory controller to increase speeds beyond DDR5 specifications.

Multiplexed Rank DIMMs provide the highest bandwidth, lowest latency main memory, with large capacity and improved performance per watt.

MRDIMMs combine two DDR5 RDIMMS on a single module, meaning that it then offers double the data throughput.

HBM and MRDIMM are two different forms of advanced memory technology:

• HBM (High Bandwidth Memory) uses 3D stacking technology to achieve high bandwidth for GPUs and AI applications.
• MRDIMMs are an evolution of more traditional DDR5 DIMM technologies, whose development allows for higher capacity and bandwidth in servers.

A DIMM (Dual In-line Memory Module) is a printed circuit board with DRAM chips and pins designed to fit into a compatible slot on the motherboard.

DIMM memory is defined by its "dual in-line" design, which means that it has electrical contacts on both sides, and so can offer faster and more efficient data transfer compared to its predecessor, the SIMM.

As such, DIMM memory is a way of improving a computer's overall performance, enabling it to handle more complex workloads and applications. 

No. JEDEC has not yet released the standard for MRDIMM. This is the first version of MRDIMM that supports Intel® Xeon® 6 processors.

When JEDEC releases the MRDIMM standard, Micron will support a JEDEC-compliant version.

No. It is only compliant on the Intel® Xeon® 6 processors.