MTFC8GAKAJCN-4M IT

Orderable parts

MTFC8GAKAJCN-4M IT

Specs

  • Chipset Validation
    N/A
  • Density
    8GB
  • FBGA Code
    JY997
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

4GB, 8GB, IT, 5.0-compliant e·MMC Data Sheet

MTFC4GACAJCN-4M IT, MTFC8GAKAJCN-4M IT: J54A, J55L; PS8225; VFBGA153; 16MB boot area; Rev F
  • File Type: PDF
  • Updated: 2018-07-03

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 8/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 8/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 8/1/2020

Simulation Models

IBIS embedded IT eMMC 5.0 (PS8225) - rev 1.1

J54A, J55L; PS8225; VFBGA153
  • File Type: ZIP
  • Updated: 2017-03-13

Technical Notes

TN-31-19: Adding a Delay Before LPM in UFS Mobile Platforms

This technical note recommends the addition of a delay before low-power mode in UFS platforms.
  • File Type: PDF
  • Updated: 2020-07-14

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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