MTFC8GAKAJCN-4M IT

Orderable parts

MTFC8GAKAJCN-4M IT

Specs

  • Chipset Validation
    N/A
  • Density
    8GB
  • FBGA Code
    JY997
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

4GB, 8GB, IT, 5.0-compliant e·MMC Data Sheet

MTFC4GACAJCN-4M IT, MTFC8GAKAJCN-4M IT: J54A, J55L; PS8225; VFBGA153; 16MB boot area; Rev F
  • File Type: PDF
  • Updated: 2018-07-03

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 1/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 1/1/2020

Simulation Models

IBIS embedded IT eMMC 5.0 (PS8225) - rev 1.1

J54A, J55L; PS8225; VFBGA153
  • File Type: ZIP
  • Updated: 2017-03-13

Technical Notes

TN-31-03: Best Practices for UFS Power Management

This technical note describes how to manage power up/off in customer systems that use Micron's Universal Flash Storage (UFS) 2.1 devices, as well as how to use the hardware reset function.
  • File Type: PDF
  • Updated: 2019-11-14

TN-29-85: UFS Memory Health Report for Mobile Devices

This technical note describes how to obtain the health report information for Micron's UFS devices.
  • File Type: PDF
  • Updated: 2019-05-10
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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