MT48LC8M16A2B4-6A XIT

Orderable parts

MT48LC8M16A2B4-6A XIT:L

Specs

  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    128Mb
  • FBGA Code
    D9QXT
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    Yes
  • Product Longevity Program Start Date
    4/16/2012
  • Width
    x16

Data Sheets

128Mb: x4, x8, x16 SDRAM

  • File Type: PDF
  • Updated: 2014-09-09

128Mb: x4, x8, x16 SDRAM Addendum

  • File Type: PDF
  • Updated: 2014-03-20

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 11/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2021

Simulation Models

HSpice

2.0 (Die Rev. L)
  • File Type: ZIP
  • Updated: 2011-08-26

IBIS

2.0 (Die Rev. L)
  • File Type: ZIP
  • Updated: 2019-09-03

64Mb - 512Mb SDRAM Verilog Model

Revision 2.3
  • File Type: ZIP
  • Updated: 2016-05-12

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

LVTTL Derating for SDRAM Slew Rate Violations

Describes the proper setup and hold time derating when the slew rate during transition time violates specification.
  • File Type: PDF
  • Updated: 2009-11-19
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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