MT48LC16M16A2TG-75

Orderable parts

MT48LC16M16A2TG-75:D

Specs

  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    256Mb
  • FBGA Code
    N/A
  • Op. Temp.
    0C to +70C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-48-15: Backward Compatibility for Faster SDRAM

This technical note reviews the timing differences between SDRAM generations and shows how the faster Micron parts are compatible with the slower parts.
  • File Type: PDF
  • Updated: 2005-10-16
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
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