MT49H32M9FM-33

Orderable parts

MT49H32M9FM-33

Specs

  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    DQJMS
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x9

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-49-03: RLDRAM 2 Clocking Strategies

This technical note addresses the operation of the RLDRAM 2 device outside the specified range of clock periods and the timing changes that occur in this mode of operation.
  • File Type: PDF
  • Updated: 2012-10-04
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
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