MT49H32M9FM-25

Orderable parts

MT49H32M9FM-25
MT49H32M9FM-25:B

Specs

  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    DQJMT
  • Op. Temp.
    0C to +95C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x9
  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    D9NDH
  • Op. Temp.
    0C to +95C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x9

Data Sheets

288Mb: x36, x18, x9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM 2

  • File Type: PDF
  • Updated: 2015-10-09

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2020

Simulation Models

HSpice

REV 2.1. Die Rev B
  • File Type: ZIP
  • Updated: 2011-07-27

BSDL

REV 1.0 (Die Rev B)
  • File Type: ZIP
  • Updated: 2011-06-23

IBIS

REV 2.5 (Die Rev B)
  • File Type: ZIP
  • Updated: 2015-08-12

Verilog

3.12
  • File Type: ZIP
  • Updated: 2009-12-17

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-44-01: RLDRAM 3 Design Guide

Contains practical recommendations for developing high-performance memory subsystems while ensuring stability for long-term reliable operation of the devices.
  • File Type: PDF
  • Updated: 2011-08-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-37: Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09
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