MT44K32M18RB-125E IT

Orderable parts

MT44K32M18RB-125E IT:A

Specs

  • Chipset Validation
    N/A
  • Density
    576Mb
  • FBGA Code
    D9PNF
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 3
  • Width
    x18

Data Sheets

576Mb: x18, x36 RLDRAM 3

  • File Type: PDF
  • Updated: 2019-01-18

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 8/1/2020

Simulation Models

MT44K32M18 Rev B1.0 BSDL

  • File Type: TXT
  • Updated: 2016-12-01

MT44K32M18 Rev A 1.1 BSDL

  • File Type: TXT
  • Updated: 2012-07-12

HSpice

Rev 2.1 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2012-10-11

IBIS

Rev 2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2012-03-15

RLDRAM 3 Verilog Model

(Rev 1.20)
  • File Type: ZIP
  • Updated: 2015-05-07

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-49-04: Calculating Memory System Power for RLDRAM 2

This techincal note details how RLDRAM 2 devices consume power and provides tools to estimate power consumption.
  • File Type: PDF
  • Updated: 2012-10-10
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Customer Service Notes

CSN-20: Wafer Packaging and Packaging Materials

Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
  • File Type: PDF
  • Updated: 2019-10-31

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29
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