MT53E768M32D4DT-053 AIT

Orderable parts

MT53E768M32D4DT-053 AIT:E


  • Chipset Validation
  • Cycle Time
  • Data Rate
  • Density
  • FBGA Code
  • Op. Temp.
    -40C to +95C
  • Part Status
  • Product Longevity Program
  • Product Longevity Program Start Date
  • Technology
  • Width

Data Sheets

Production Data Sheet: 200b: x32 Automotive LPDDR4/LPDDR4X SDRAM (Z1AM)

MT53E384M32D2, MT53E768M32D4
  • File Type: PDF
  • Updated: 2020-04-01


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 8/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 8/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 8/1/2020

Simulation Models


6Gb Mobile LPDDR4, Die Rev. E, WT, XT, UT, AT, IT, 200b, 366b, 376b, 556b
  • File Type: ZIP
  • Updated: 2020-06-10

IBIS: 6Gb Mobile LPDDR4 Z1AM

WT, XT, UT, AT, IT, Z1AM Mobile LPDDR4 SDRAM, Die Rev. E, 200b, 366b, 376b, 556b
  • File Type: ZIP
  • Updated: 2020-06-10

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-42-02: LPDDR2 Dual Die Package to Single Die Package Migration

This technical note provides information to enable migration of a Micron 1Gb LPDDR2 product from a dual-die package to a single-die package.
  • File Type: PDF
  • Updated: 2014-12-18
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Customer Service Notes

CSN-33: Micron BGA Manufacturer's User Guide

Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
  • File Type: PDF
  • Updated: 2020-04-21

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29
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