MT53E384M32D2DS-053 AIT

Orderable parts

MT53E384M32D2DS-053 AIT:E

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR4-3732
  • Density
    12Gb
  • FBGA Code
    D9WRL
  • Op. Temp.
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x32

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2019

Simulation Models

HSPICE: 6Gb Mobile LPDDR4 Z1AM

6Gb Mobile LPDDR4, Die Rev. E, WT, XT, UT, AT, IT, 200b, 366b, 376b, 556b
  • File Type: ZIP
  • Updated: 2019-08-30

IBIS: 6Gb Mobile LPDDR4 Z1AM

WT, XT, UT, AT, IT, Z1AM Mobile LPDDR4 SDRAM, Die Rev. E, 200b, 366b, 376b, 556b
  • File Type: ZIP
  • Updated: 2019-10-15

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
See All

Customer Service Notes

CSN-33: Micron BGA Manufacturer's User Guide

Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
  • File Type: PDF
  • Updated: 2019-09-17

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29
See All
+