MT53E256M16D1DS-046 WT

Orderable parts

MT53E256M16D1DS-046 WT:B

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    4266Mbps
  • Density
    4Gb
  • FBGA Code
    D9XFW
  • Op. Temp.
    -35C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x16

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 8/1/2020

Simulation Models

HSPICE: 4Gb LPDDR4 Z00M

WT, UT, AT, IT, XT, Z00M Mobile LPDDR4 SDRAM, Die Rev. B
  • File Type: ZIP
  • Updated: 2019-04-19

IBIS: 4Gb Mobile LPDDR4 Z00M

WT, UT, AT, IT, XT, Z00M Mobile LPDDR4 SDRAM, Die Rev. B, 366b 8DP, 200b SDP, 200b DDP, 376b QDP
  • File Type: ZIP
  • Updated: 2019-07-26

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-42-02: LPDDR2 Dual Die Package to Single Die Package Migration

This technical note provides information to enable migration of a Micron 1Gb LPDDR2 product from a dual-die package to a single-die package.
  • File Type: PDF
  • Updated: 2014-12-18
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Customer Service Notes

CSN-20: Wafer Packaging and Packaging Materials

Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
  • File Type: PDF
  • Updated: 2019-10-31

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29
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