MT52L512M64D4GN-107 WT

Orderable parts

MT52L512M64D4GN-107 WT:B


  • Chipset Validation
  • Cycle Time
  • Data Rate
  • Density
  • FBGA Code
  • Op. Temp.
    -30C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
  • Product Longevity Program Start Date
  • Technology
  • Width

Data Sheets

EOL: V01M 256-Ball, Dual-Channel Mobile LPDDR3 SDRAM

DDP, QDP, 14x14, MT52L256M64D2GN-107 WT:B, MT52L512M64D4GN-107 WT :B, MT52L256M64D2FT-107 WT :B
  • File Type: PDF
  • Updated: 2018-04-11


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2022

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2022

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2022

Simulation Models

IBIS: V01M Die 168-Ball / 178-Ball / 256-Ball / 253-Ball /216-Ball / SDP_DDP_TDP_QDP_8DP Mobile LPDDR3 SDRAM

Rev 1.6_XT/WT, Rev 1.3_IT, Die, 168-Ball, 178-Ball, 256-Ball, 253-Ball, 216-Ball, SDP, DDP, TDP, QDP, 8DP, LPDDR3 SDRAM
  • File Type: ZIP
  • Updated: 2021-04-22

Verilog: 8Gb Mobile LPDDR3 V01M

Verilog simulation model for 8Gb Mobile LPDDR3
  • File Type: ZIP
  • Updated: 2017-12-25

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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