MT52L256M64D2LZ-107 WT

Orderable parts

MT52L256M64D2LZ-107 WT:B


  • Chipset Validation
  • Cycle Time
  • Data Rate
  • Density
  • FBGA Code
  • Op. Temp.
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  • Product Longevity Program Start Date
  • Technology
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Data Sheets

216-Ball, Dual-Channel Embedded LPDDR3 SDRAM

LPDDR3, 216-ball, V01M, dual-channel, embedded, MT52L256M64D2
  • File Type: PDF
  • Updated: 2017-03-02


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 10/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 10/1/2019

Simulation Models

IBIS: V01M Die 168-Ball / 178-Ball / 256-Ball / 253-Ball /216-Ball / SDP_DDP_TDP_QDP_8DP Mobile LPDDR3 SDRAM

Rev 1.5_XT/WT, Rev 1.2_IT, Die, 168-Ball, 178-Ball, 256-Ball, 253-Ball, 216-Ball, SDP, DDP, TDP, QDP, 8DP, LPDDR3 SDRAM
  • File Type: ZIP
  • Updated: 2018-04-25

Verilog: 8Gb Mobile LPDDR3 V01M

Verilog simulation model for 8Gb Mobile LPDDR3
  • File Type: ZIP
  • Updated: 2017-12-25

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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