MT46H32M32LFB5-6 IT

Orderable parts

MT46H32M32LFB5-6 IT:B


  • Ball Count
  • Chipset Validation
  • Cycle Time
  • Density
  • FBGA Code
  • Op. Temp.
    -40C to +85C
  • Product Longevity Program
  • Product Longevity Program Start Date
  • Technology
  • Width

Data Sheets

1Gb: x16, x32 Mobile LPDDR SDRAM (Recommended for new designs)

  • File Type: PDF
  • Updated: 2018-10-17

Simulation Models

HSpice: 1Gb Mobile LPDDR T68M

Rev. 2.1
  • File Type: ZIP
  • Updated: 2011-06-10

IBIS: 1Gb Mobile LPDDR T68M

Rev 2.2
  • File Type: ZIP
  • Updated: 2018-04-11

LPDDR Verilog Model

  • File Type: ZIP
  • Updated: 2011-04-04

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-42-02: LPDDR2 Dual Die Package to Single Die Package Migration

This technical note provides information to enable migration of a Micron 1Gb LPDDR2 product from a dual-die package to a single-die package.
  • File Type: PDF
  • Updated: 2014-12-18

TN-46-12: Mobile DRAM Power-Saving Features and Calculations

This technical note addresses the power-saving features and power calculations of low-power Mobile LPDRAM memory.
  • File Type: PDF
  • Updated: 2009-05-16
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All