MT46H32M32LFB5-6 IT

Rev. 2.1

Rev 2.2

6.05

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

This technical note provides information to enable migration of a Micron 1Gb LPDDR2 product from a dual-die package to a single-die package.

This technical note addresses the power-saving features and power calculations of low-power Mobile LPDRAM memory.

Explanation of Micron packaging labels and procedures.

Describes design considerations for bare die SiPs and MCMs.