MT46H32M32LFB5-6 IT

Orderable parts

MT46H32M32LFB5-6 IT:B


  • Ball Count
  • Chipset Validation
  • Cycle Time
  • Density
  • FBGA Code
  • Op. Temp.
    -40C to +85C
  • Part Status
  • Product Longevity Program
  • Product Longevity Program Start Date
  • Technology
  • Width

Data Sheets

1Gb: x16, x32 Mobile LPDDR SDRAM (Recommended for new designs)

  • File Type: PDF
  • Updated: 2018-10-17

Simulation Models

HSpice: 1Gb Mobile LPDDR T68M

Rev. 2.1
  • File Type: ZIP
  • Updated: 2011-06-10

IBIS: 1Gb Mobile LPDDR T68M

Rev 2.2
  • File Type: ZIP
  • Updated: 2018-04-11

LPDDR Verilog Model

  • File Type: ZIP
  • Updated: 2011-04-04

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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