EDF8164A3MA-JD-F

Orderable parts

EDF8164A3MA-JD-F-D
EDF8164A3MA-JD-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1866
  • Density
    8Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x64
  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1866
  • Density
    8Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x64

Data Sheets

Production Data Sheet: 8Gb, 16Gb: 253-Ball, Dual-Channel 2E0F Mobile LPDDR3 SDRAM

253-ball, 11x11, DDP, QDP, Dual-Channel, LPDDR3 SDRAM
  • File Type: PDF
  • Updated: 2015-02-24

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2020

Simulation Models

IBIS: 253-ball 2E0F DDP Mobile LPDDR3 SDRAM

Rev 1.0 253-ball, DDP, LPDDR3 SDRAM
  • File Type: ZIP
  • Updated: 2014-09-02

Verilog: 4Gb Mobile LPDDR3 2E0F

Verilog simulation model for 4Gb Mobile LPDDR3
  • File Type: ZIP
  • Updated: 2018-01-23

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
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