EDBM432B3PD-1D-F

Orderable parts

EDBM432B3PD-1D-F-D
EDBM432B3PD-1D-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    12Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x32
  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    12Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x32

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-37: Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09
See All
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