EDB8132B4PB-8D-F

Orderable parts

EDB8132B4PB-8D-F-D
EDB8132B4PB-8D-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    2.5ns
  • Data Rate
    LPDDR2-800
  • Density
    8Gb
  • FBGA Code
    D9XCG
  • Op. Temp.
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x32
  • Chipset Validation
    N/A
  • Cycle Time
    2.5ns
  • Data Rate
    LPDDR2-800
  • Density
    8Gb
  • FBGA Code
    D9XCH
  • Op. Temp.
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x32

Data Sheets

168-Ball Embedded LPDDR2 SDRAM

EDB8132B4PB-8D-F
  • File Type: PDF
  • Updated: 2016-01-20

168-Ball LPDDR2 SDRAM Addendum

2E0E
  • File Type: PDF
  • Updated: 2014-07-02

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 10/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 10/1/2019

Simulation Models

IBIS: 2E0E Mobile LPDDR2 SDRAM

Rev 1.2, LPDDR2 SDRAM, AT, IT, UT, WT, XT; EDB4416BBBH-1DIT-F, EDB8164B4PT-1DAT-F, EDB8164B4PT-1DIT-F, EDB8164B4PT-1D-F, EDBA164B2PR-1D-F, EDB8132B4PB-8D-F, EDB8132B4PM-1D-F
  • File Type: ZIP
  • Updated: 2017-06-05

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
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