EDB8132B3MC-8D-F

Orderable parts

EDB8132B3MC-8D-F-D
EDB8132B3MC-8D-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    2.5ns
  • Data Rate
    LPDDR2-800
  • Density
    8Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -25C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x32
  • Chipset Validation
    N/A
  • Cycle Time
    2.5ns
  • Data Rate
    LPDDR2-800
  • Density
    8Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -25C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x32

Data Sheets

Production Data Sheet: 134-ball 2C0E Mobile LPDDR2 SDRAM

8Gb, DDP, 256 x 32
  • File Type: PDF
  • Updated: 2014-02-26

Simulation Models

IBIS: 134-Ball 2C0E DDP Mobile LPDDR2 SDRAM

Rev 1.01
  • File Type: ZIP
  • Updated: 2014-02-28

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-00-09: Accelerate Design Cycles with Simulation Models

Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
  • File Type: PDF
  • Updated: 2010-02-09
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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