MT40A2G4SA-062E

Orderable parts

MT40A2G4SA-062E:E
MT40A2G4SA-062E:J
MT40A2G4SA-062E:R

Specs

  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D9WFK
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4
  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D9WSL
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4
  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D8BPH
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4

Data Sheets

8Gb: x4, x8, x16 DDR4 SDRAM

8Gb: x4, x8, x16 DDR4 SDRAM
  • File Type: PDF
  • Updated: 2021-09-28

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2021

Simulation Models

8Gb DDR4 HSPICE: Z11B

Rev. 2.7.1 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2020-05-08

8Gb DDR4 IBIS: Z41C

Rev. 2.2.1 (Die Rev. R)
  • File Type: ZIP
  • Updated: 2021-09-01

8Gb DDR4 IBIS: Z11B

Rev. 2.8.2 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2021-01-12

8Gb DDR4 IBIS: Z21C

Rev. 2.2.1 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2020-08-20

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 2018-06-27

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2018-08-29
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
See All
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