MT40A1G16KH-062E AUT

Orderable parts

MT40A1G16KH-062E AUT:E

Specs

  • Chipset Validation
    N/A
  • Density
    16Gb
  • FBGA Code
    D8BHR
  • Op. Temp.
    -40C to +125C
  • Part Status
    Sampling
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

16Gb: x8, x16 Automotive DDR4 SDRAM

MT40A2G8, MT40A1G16
  • File Type: PDF
  • Updated: 2020-07-30

Simulation Models

16Gb DDR4 Automotive IBIS: Z32D

Rev. 2.4.2 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2021-05-19

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2018-08-29
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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