MT41K64M16JT-15E

Orderable parts

MT41K64M16JT-15E:G

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1333
  • Density
    1Gb
  • FBGA Code
    D9MPK
  • Features
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

1Gb: x4, x8, x16 DDR3L SDRAM

  • File Type: PDF
  • Updated: 2018-09-20

Simulation Models

HSpice

2.1 (Die Rev. G)
  • File Type: ZIP
  • Updated: 2011-07-08

IBIS

2.2 (Die Rev. G)
  • File Type: ZIP
  • Updated: 2014-12-02

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-00-07: IBIS Behavioral Models

Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
  • File Type: PDF
  • Updated: 2009-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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