MT41K512M8DA-093

Orderable parts

MT41K512M8DA-093:P

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-2133
  • Density
    4Gb
  • FBGA Code
    D9SHB
  • Features
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8

Data Sheets

4Gb: x4, x8, x16 DDR3L SDRAM

4Gb, x4, x8, x16 DDR3L SDRAM data sheet
  • File Type: PDF
  • Updated: 2018-10-26T05:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2019

Simulation Models

HSpice

2.0 (Die Rev. P)
  • File Type: ZIP
  • Updated: 2015-08-27T05:00:00.0000000Z

IBIS

2.0 (Die Rev. P)
  • File Type: ZIP
  • Updated: 2018-08-30T05:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17T15:39:00.0000000Z

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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