MT41K512M16TNA-125 M

Orderable parts

MT41K512M16TNA-125 M:E

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1600
  • Density
    8Gb
  • FBGA Code
    D9QTJ
  • Features
    DDR3L-RS
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

8Gb: x16 TwinDie DDR3L-RS SDRAM

  • File Type: PDF
  • Updated: 2013-05-07

Simulation Models

HSpice

1.1 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2013-05-15

IBIS

1.1 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2013-05-15

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-00-07: IBIS Behavioral Models

Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
  • File Type: PDF
  • Updated: 2009-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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