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MT41K2G4TRF-125

Orderable parts

MT41K2G4TRF-125:E

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1600
  • Density
    8Gb
  • FBGA Code
    D9PZB
  • Features
  • Op. Temp.
    0C to +95C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4

Technical Notes

TN-00-37: Relationship of Glass Transition Temperature (TG) to Operating Temperature (TO)

This tech note describes how glass transition temperature (TG) is measured and the relationship between TG and the operating temperature (TO) of Micron’s devices as stated in our data sheets
  • File Type: PDF
  • Updated: 2023-08-08

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
See All
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