MT41K256M8DA-125

Orderable parts

MT41K256M8DA-125:K

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1600
  • Density
    2Gb
  • FBGA Code
    D9PSH
  • Features
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

2Gb: x4, x8, x16 DDR3L SDRAM

2Gb: x4, x8, x16 DDR3L SDRAM
  • File Type: PDF
  • Updated: 2018-09-21

2Gb: x4, x8, x16 DDR3 SDRAM

  • File Type: PDF
  • Updated: 2016-02-29

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2020

Simulation Models

HSpice: 2Gb DDR3L SDRAM V89C

2.1 (Die Rev. K)
  • File Type: ZIP
  • Updated: 2012-05-01

IBIS: 2Gb DDR3L SDRAM V89C

Revision 2.2 (Die Rev. K)
  • File Type: ZIP
  • Updated: 2016-07-28

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-00-09: Accelerate Design Cycles with Simulation Models

Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
  • File Type: PDF
  • Updated: 2010-02-09
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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