MT41K1G8RKB-107

Orderable parts

MT41K1G8RKB-107:N

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1866
  • Density
    8Gb
  • FBGA Code
    D9SXR
  • Features
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

8Gb: x4, x8 TwinDie DDR3L SDRAM

Rev. K
  • File Type: PDF
  • Updated: 2018-08-02

Simulation Models

HSPICE: 8Gb TwinDie DDR3/DDR3L SDRAM

1.0 (Die Rev. P)
  • File Type: ZIP
  • Updated: 2018-05-07

IBIS: 8Gb TwinDie DDR3/DDR3L SDRAM

1.0 (Die Rev. P)
  • File Type: ZIP
  • Updated: 2018-05-07

IBIS: 8Gb TwinDie DDR3/DDR3L SDRAM

2.0 (Die Rev. N)
  • File Type: ZIP
  • Updated: 2015-10-06

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-00-07: IBIS Behavioral Models

Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
  • File Type: PDF
  • Updated: 2009-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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