MT41K1G16DGA-125

Orderable parts

MT41K1G16DGA-125:A

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1600
  • Density
    16Gb
  • FBGA Code
    D9STR
  • Features
  • Op. Temp.
    0C to +95C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2020

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-41-16: DDR3 8Gb DDP 2CS to 8Gb SDP 1CS Transition Guide

This technical note explains how to transition a dual-rank 8Gb 2CS (dual die) MT41K512M16 DDP device to a single-rank 8Gb 1CS (monolithic) MT41K512M16 SDP device.
  • File Type: PDF
  • Updated: 2014-02-12
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
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