Orderable parts


Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-41-16: DDR3 8Gb DDP 2CS to 8Gb SDP 1CS Transition Guide

This technical note explains how to transition a dual-rank 8Gb 2CS (dual die) MT41K512M16 DDP device to a single-rank 8Gb 1CS (monolithic) MT41K512M16 SDP device.
  • File Type: PDF
  • Updated: 2014-02-12
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
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