MT47H64M16NF-25E XIT

Orderable parts

MT47H64M16NF-25E XIT:M

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR2-800
  • Density
    1Gb
  • FBGA Code
    D9SBC
  • Op. Temp.
    -40C to +95C
  • Part Status
    Production
  • Product Longevity Program
    Yes
  • Product Longevity Program Start Date
    05/04/2011
  • Width
    x16

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2020

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-47-19: DDR2 (Point-to-Point) Features and Functionality

This technical note focuses on the unique memory requirements of point-to-point design layouts and describes DDR2 features and functionality.
  • File Type: PDF
  • Updated: 2011-03-18
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Customer Service Notes

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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