MT47H64M16NF-187E

Orderable parts

MT47H64M16NF-187E:M

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR2-1066
  • Density
    1Gb
  • FBGA Code
    D9RZP
  • Op. Temp.
    0C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

1Gb: x4, x8, x16 DDR2 SDRAM

  • File Type: PDF
  • Updated: 2018-09-25

1Gb: x4, x8, x16 DDR2 SDRAM Addendum

  • File Type: PDF
  • Updated: 2014-09-30

Simulation Models

HSpice: 1Gb DDR2 SDRAM

Rev. 2.0
  • File Type: ZIP
  • Updated: 2016-02-06

IBIS: 1Gb DDR2 SDRAM U88B

Rev. 2.2
  • File Type: ZIP
  • Updated: 2016-02-05

1024Mb DDR2 Verilog Model

5.83
  • File Type: ZIP
  • Updated: 2010-04-29

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-47-08: DDR2 Package Sizes and Layout Requirements

This technical note covers DDR2 package sizes and layout requirements.
  • File Type: PDF
  • Updated: 2005-11-16
See All

Customer Service Notes

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
+