MT47H32M16NF-25E AAT

Orderable parts

MT47H32M16NF-25E AAT:H

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR2-800
  • Density
    512Mb
  • FBGA Code
    D9SCD
  • Op. Temp.
    -40C to +105C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

512Mb: x8, x16 Automotive DDR2 SDRAM

MT47H64M8, MT47H32M16
  • File Type: PDF
  • Updated: 2021-09-21

512Mb: x8, x16 Automotive DDR2 SDRAM Addendum

MT47H64M8, MT47H32M16
  • File Type: PDF
  • Updated: 2018-06-14

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 11/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2021

Simulation Models

HSpice: 512Mb DDR2 SDRAM U87B

Rev. 2.1
  • File Type: ZIP
  • Updated: 2016-02-05

IBIS: 512Mb DDR2 SDRAM U87B

Rev. 2.2
  • File Type: ZIP
  • Updated: 2016-02-05

512Mb DDR2 Verilog Model

5.83
  • File Type: ZIP
  • Updated: 2010-04-29

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-47-08: DDR2 Package Sizes and Layout Requirements

This technical note covers DDR2 package sizes and layout requirements.
  • File Type: PDF
  • Updated: 2005-11-16
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Customer Service Notes

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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