MT46V64M8CY-5B IT

Orderable parts

MT46V64M8CY-5B IT:J

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR400B
  • Density
    512Mb
  • FBGA Code
    D9MLM
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

512Mb: x4, x8, x16 DDR SDRAM

  • File Type: PDF
  • Updated: 2011-07-28

Simulation Models

HSpice

2.0 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2011-01-12

IBIS

2.3 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2019-09-03

Veriloq

  • File Type: ZIP
  • Updated: 2007-06-21

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-46-06: Termination for Point-to-Point Systems

Provides a basic understanding of transmission line theory that is important to insure signal integrity in today's high-speed digital systems.
  • File Type: PDF
  • Updated: 2011-03-01
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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