MT46V32M16CY-5B

2.0 (Die Rev. J)

2.3 (Die Rev. J)

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

This technical note provides hardware tips for point-to-point system design including termination, layout, and routing.

Provides a decoupling capacitor calculation for a DDR memory channel

Explanation of Micron packaging labels and procedures.

Describes design considerations for bare die SiPs and MCMs.