MTA18ADF4G72AZ-2G6

Orderable parts

MTA18ADF4G72AZ-2G6B2

Specs

  • Chipset Validation
    N/A
  • Comp. Config
  • Data Rate
    2666 MT/s
  • Density
    32GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72

Data Sheets

288-Pin DDR4 UDIMM Core Data Sheet

  • File Type: PDF
  • Updated: 2019-10-14

32GB (x72, ECC, DR) 288-Pin DDR4 VLP UDIMM

MTA18ADF4G72AZ – 32GB
  • File Type: PDF
  • Updated: 2019-03-19

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 4/1/2021

Simulation Models

HyperLynx

B2
  • File Type: ZIP
  • Updated: 2021-03-03

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-00-18: Uprating Semiconductors for High-Temperature Applications

This technical note describes the issues associated with temperature uprating and the risks involved in using components outside the manufacturer's environmental specifications; including, thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, package reliability and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-02-28

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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