MTA36ASF2G72PZ-2G1

Contact Sales

Orderable parts

MTA36ASF2G72PZ-2G1A2

MTA36ASF2G72PZ-2G1B1

Specs

Chipset Validation

N/A
Comp. Config

1Gb x 4
Data Rate

2133 MT/s
Density

16GB
FBGA Code

N/A
Product Longevity Program

No
Product Longevity Program Start Date

N/A
SPD Data

See SPD Data
Width

x72

Chipset Validation

N/A
Comp. Config

1Gb x 4
Data Rate

2133 MT/s
Density

16GB
FBGA Code

N/A
Product Longevity Program

No
Product Longevity Program Start Date

N/A
SPD Data

See SPD Data
Width

x72

Simulation Models

Spice

A2

File Type: ZIP
Updated: 2014-05-29

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Hyperlynx

A2

File Type: ZIP
Updated: 2014-08-27

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Technical Notes

TN-00-01: Moisture Sensitivity of Plastic Packages

This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

File Type: PDF
Updated: 2023-08-25

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TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

File Type: PDF
Updated: 2022-08-09

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TN-04-42: Memory Module Serial Presence-Detect

This technical note describes how serial presence-detect (SPD) is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules.

File Type: PDF
Updated: 2009-12-16

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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.

File Type: PDF
Updated: 2021-12-06

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CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.

File Type: PDF
Updated: 2009-04-06

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See All