Whether your design requires high bandwidth, low power, high density, ultra-low latency, or high speed, we have the DRAM solution for you.
We build our modules from start to finish—designing, manufacturing, and testing all of the DRAM ourselves before assembling the modules and testing again. So, from high-performance SODIMMs to high-density LRDIMMs, you can depend on the quality and reliability of our devices.
By overcoming complex ECC and data-management challenges, our fully managed NAND devices ease technology transitions and integration while improving system performance and reliability.
Micron does more than design and manufacture NAND Flash memory. We strive to solve design challenges through better engineering—by raising the bar on NAND products that cover everything from mobile to embedded, to enterprise storage applications.
Whether you’re designing for wireless, embedded, or automotive applications, our extensive portfolio of serial and parallel NOR Flash solutions delivers the right mixture of performance, cost, and design continuity, backed by years of Micron Flash memory expertise.
Get the critical features and functions for your design—including high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges—from our broad portfolio of industry-standard multichip packages (MCPs).
Hybrid Memory Cube (HMC) represents an entirely new leap forward in memory technology. It combines high-speed logic and DRAM layers into one optimized 3D package that leverages through-silicon via (TSV) technology.